波焊板上的接触问题

我想你的波浪中存在相当大的磁通污染 - 如果这个问题非常关键，那么这是在选定的区域还是“全部”，你可以查看你的流程同事是否有更多“测试友好”的通量 -
他们还可以考虑修改载体，以便为不需要波焊接的tstpoints提供更多保护，确保你有一个良好的真空动作（良好的捕捉），联系你当地的夹具代表 - 他们可以推荐更高的力探针，更锋利的提示
对于测试点 - 同时也增加了夹具维护计划并每隔4-8小时清洁夹具探针，使用符合ESD标准的非线刷，并且还在3070的测试计划中使用IYET功能，这样可以仅在模拟部分重新进行夹具和重新测试
如果所有这些仍然失败，那些边际失败，操作员将需要在测试前清理板..希望这有帮助！



以下为原文

I guess you have quite an aggressive flux contamination from the wave -

is this in selected areas or 'all over'

if the problem is really critical, you can review if there is a more ';test friendly' flux available with your process colleagues -

they could also looked at modifying carriers to give more protection to tstpoints that dont need wave soldered

for fixturing, make sure you have a good vaccum action (good snap), contact your local fixture rep - they can recommend higher force probes, with sharper tips for testpoints - asnd also increase the fixture maintanance schedule and clean the fixture probes every 4-8 hours with ESD compliant, non wire brush

and also utilise the IYET feature in testplan of 3070, this allows recycle of fixture and retest in analog section on only those marginal fails

if all this is still failing, operator will need to clean board before test..

hope this is helping !