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亲爱的先生，我需要使用ADS2009生成两层布局。
你能帮助我生成两层，如下图TWO_LAYER_LAYOUT_EXAMPLE所示。 从原理图生成到布局生成生成两个层需要做什么设置。 我们需要上层和下层，在上层和下层之间，有基板间隙，如何设置两层之间的基板高度。 我需要生成如图TWO_LAYER_LAYOUT_EXAMPLE所示。 我需要在ADS原理图中连接以生成如下所示的内容。 你有没有人在ADS 2009上有帮助文件生成两层，你能告诉我吗？ TWO_LAYER_LAYOUT_EXAMPLE.png7.8 KB 以上来自于谷歌翻译 以下为原文 Dear Sir, I need to generate two layers layout using ADS2009. Can you anybody help me to generate the two layers as shown in the below in the figure TWO_LAYER_LAYOUT_EXAMPLE. What are the setting need to do for generating two layers from schematic to layout generation . We need upper layer and bottom layer , in between upper and bottom layer , there is substrate gap, how to set this height of the substrate between two layers. I need to generate as shown in the figure TWO_LAYER_LAYOUT_EXAMPLE. What I need to connect in the schematic of the ADS to generate as shown below. Can you anybody having help document for generating two layers in ADS 2009 , can you show me. 附件 
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13个回答
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为了获得双面布局链接MLIN TL3与不同的基板实例交换了Cond1和Cond2层设置，假设cond和cond2是为双面板金属化配置的两个层。
子基板的厚度由原理图上显示的基板实例设置。 以上来自于谷歌翻译 以下为原文 To get a two sided layout link the MLIN TL3 with a different substrate instance that has the Cond1 and Cond2 layer settings swapped over, assuming cond and cond2 are the two layers configured for the double sided board metalizations. The thickness of the substare is set by the substrate instance shown on your schematic. |
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411easdd*** 发表于 2018-12-7 09:32 sdgrant先生，我是这两层布局生成的初学者，我不知道如何生成这两层。 我知道只需要MLIN，MSBEND，MCORN来生成所需的形状，然后按生成/更新布局并生成单层。 我是这个双层的新手。 你能告诉我生成双层的帮助文件或者我要求你详细说明，如何获得厚度为0.508mm的基板分隔的双层。 以上来自于谷歌翻译 以下为原文 sdgrant Sir, I am beginner for this two layer layout generation, I don't know how to generate the two layers. I know only place the MLIN's, MSBEND, MCORN for the required shape generation and press Generate/Update Layout and generating the single layer. I am new to this double layer. Can you show me the help document for generating double layers or I request you to tell in detail , how to obtain the double layer separated by substrate of thickness 0.508mm. |
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2018-12-7 16:27:09
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MCORN元素的目的是什么？ 这些不是必需的，可能导致更多的混乱而不是必要的。 特别是Corn3和Corn4，因为您已将这些分配给电路板的顶部，但两个过孔之间只应存在底部元件。 你只需要MLIN - VIA2 - MLIN - VIA2 - MLIN。 此外，VIA2元素的大小与MLIN的大小不匹配。 对于3D视图，您只映射了cond，因此您只能看到该图片中的顶部金属。 您需要映射cond2和孔layeres以查看电路的所有元素。 以上来自于谷歌翻译 以下为原文 What is the purpose of the MCORN elements? These are not needed and probably leading to more confusion than necessary. Especially Corn3 and Corn4 as you have assigned these to the top side of the board but only bottom side elements should exist between the two vias. You only need MLIN - VIA2 - MLIN - VIA2 - MLIN. Also the size of the VIA2 elements does not match the size of the MLINs. For the 3D view you have only mapped cond so you will only see the top metal in that picture. You need to map cond2 and hole layeres to see all the element of the circuit. |
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你改变了单位，但现在一个基板的高度比另一个小1000倍。 它们应该是相同的，只有倒置的层。 为什么你再次缩小通道？ 您之前编辑它以匹配MLIN，现在它更小。 你能真正钻一个0.381毫米的洞吗？ 您使用的是ADS 2009，我在ADS 2012.08中只有基板。 这不会转换回ADS 2009。 以上来自于谷歌翻译 以下为原文 You changed the units but now the height of one substrate is 1000 times smaller than the other. They should be the same with just the layers inverted. Why have you made the via smaller again? You edited it to match the MLINs before and now it is smaller. Can you really drill a 0.381 mm hole? You are using ADS 2009, I only have the substrate in ADS 2012.08. That will not convert back to ADS 2009. |
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> {quote：title = nimbargi写道：} {quote}>一般你告诉我，如何映射cond2和孔来查看3D视图中的所有图层。 这只是最后一点要清楚。 我正在运行ADS 2012.08，其中基板定义以图形方式完成，请参阅上一篇文章。 类似的基板定义在ADS 2009这样的旧版本中是可能的，但现在这个过程完全不同。 在ADS 2012中，该过程从File> New> Substrate开始，您在ADS 2009中没有该命令选项。 以上来自于谷歌翻译 以下为原文 > {quote:title=nimbargi wrote:}{quote} > Generally you tell me,how to map the cond2 and hole to view all layers in 3D view. That is only last point left to clear. I am running ADS 2012.08 where substrate definition is done graphically, see previous post. Similar substrate definitions were possible in very old versions like ADS 2009 but the process is completely different now. In ADS 2012 the process starts with File > New > Substrate, you do not have that command option in ADS 2009. |
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411easdd*** 发表于 2018-12-7 10:32 sdgrant先生，感谢您对我的精心和耐心的帮助，非常感谢。 以上来自于谷歌翻译 以下为原文 sdgrant Sir, Thank you for your elaboration and patience help for me, thank you very much. |
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2018-12-7 17:19:10
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一旦你做了这样的事情，MLIN将不再表现出理想的MLIN，如果这真的很重要。 您必须确保以某种方式创建这些结构，并且这些结构的影响最小。 以上来自于谷歌翻译 以下为原文 As soon as you do anything like this MLINs will no longer behave exactly as ideal MLINs, if that really matters. You have to make sure that these structures are create in a way and in places where they will have least effect. |
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411easdd*** 发表于 2018-12-7 10:44 > {quote：title = sdgrant写道：} {quote}>一旦你做了这样的事情，MLINs将不再像理想的MLIN一样，如果这真的很重要。 您必须确保以某种方式创建这些结构，并且这些结构的影响最小。 sdgrant先生，对不起，我不明白，你说的是什么。 可以清除它。 以上来自于谷歌翻译 以下为原文 > {quote:title=sdgrant wrote:}{quote} > As soon as you do anything like this MLINs will no longer behave exactly as ideal MLINs, if that really matters. You have to make sure that these structures are create in a way and in places where they will have least effect. sdgrant Sir, I am sorry that I didn't understand , what you said. Can clear it. |
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2018-12-7 17:34:06
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> {quote：title = nimbargi写道：} {quote}>我们正在创建双层金属化，在底层（cond2），我们正在清除MLIN的周围部分，如下图所示。 如果我们像周围的MLIN一样清除并在底部连接MLIN，它是否会起到*缺陷的地面结构*并且不影响S-参数的结果，获得。 正确。 如果使用MLIN和其他微带模型，则此部分的电气结果不正确。 这就是从一开始就让我感到惊讶的问题：如果我们需要在Momentum中运行EM仿真来获得准确的结果，那么为什么花费这么多时间从微带元素中绘制布局呢？ 如果使用EM求解器完成电气仿真，则可以使用多边形“手动”绘制布局，并且使用MLIN和其他微带元素进行布局没有任何优势。 所以是的，你需要在Momentum中运行它来获得交叉部分的精确电气模型。 http://www.rf-design-tips.com/ads-quick-start-tutiorials-and-free-online-training/ - > ADS布局和EM（第3天） 以上来自于谷歌翻译 以下为原文 > {quote:title=nimbargi wrote:}{quote} > We are creating double layer metalization, In the bottom layer (cond2), we are clearing surrounding part of the MLIN as shown below figure. If we clear like surrounding MLIN and connecting MLIN in the bottom, will it not act as *defected ground structure* and not effect the results of S-paramters , gain. Correct. The electrical results for this section are not correct if you use MLIN and other microstrip model. That is what surprised me from the beginning in this thread: why spend so much time to draw the layout from microstrip elements, if we need to run EM simulation of the layout in Momentum anyway, for accurate results. If the electrical simulation is done with the EM solver, you can draw the layout "manually" with polygons, and there is no advantage of using MLIN and other microstrip elements for layout. So yes, you will need to run this in Momentum to get accurate electrical models for the crossover section. http://www.rf-design-tips.com/ads-quick-start-tutiorials-and-free-online-training/ --> ADS Layout and EM (Day 3) |
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亲爱的先生，由于服务器问题，它发布了很多次。编辑：nimbargi于2014年2月25日下午8:02 以上来自于谷歌翻译 以下为原文 Dear Sir, Due to server problem , it posted many times. Edited by: nimbargi on Feb 25, 2014 8:02 PM |
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2018-12-7 17:48:37
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亲爱的先生，由于服务器问题，它发布了很多次。编辑：nimbargi于2014年2月25日下午8:01 以上来自于谷歌翻译 以下为原文 Dear Sir, Due to server problem , it posted many times. Edited by: nimbargi on Feb 25, 2014 8:01 PM |
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2018-12-7 17:55:35
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亲爱的先生，由于服务器问题，它发布了很多次。编辑：nimbargi于2014年2月25日晚上8点 以上来自于谷歌翻译 以下为原文 Dear Sir, Due to server problem , it posted many times. Edited by: nimbargi on Feb 25, 2014 8:00 PM |
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2018-12-7 18:12:50
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亲爱的先生，由于服务器问题，它发布了很多次。编辑：nimbargi于2014年2月25日下午7:59 以上来自于谷歌翻译 以下为原文 Dear Sir, Due to server problem , it posted many times. Edited by: nimbargi on Feb 25, 2014 7:59 PM |
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2018-12-7 18:22:06
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