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1.4 的协议栈 和1.3的协议栈 区别在那些地方 做了几个月工程的1.3协议栈了 现在是否要移植到1。4上做做
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- This version of the Texas Instruments BLE stack and software is a minor
update to the v1.3.2 release. It contains some minor bug fixes and a few functional changes. - The BLE protocol stack, including both the controller and host, was completely retested for v1.4.0. Changes and Enhancements: - All projects have been migrated from IAR v8.10.4 to IAR 8.20.2. In order to build all projects, be sure to upgrade to IAR v8.20.2. - Updated SPI and UART_DMA drivers for improved robustness and throughput. - Added an overlapped processing feature to improve throughput and reduce power consumption in devices where peak power consumption isn't an issue. Overlapped processing allows the stack to concurrently process while the radio is active. Since the stack is concurrently processing, it is able to insert new data in the Tx buffer during the connection event, causing additional packets to be sent before the end of the event. - Added a Number of Completed Packets HCI command which offers the possibility of waiting for a certain number of completed packets before reporting to the host. This allows higher throughput when used with overlapped processing. - Added an HCI Extension command HCI_EXT_DelaySleepCmd which provides the user control of the system initialization sleep delay (wake time from PM3/boot before going back to sleep). The default sleep delay is based on the reference design 32 kHz XOSC stabilization time. - Added a low duty cycle directed advertising option. - Added support for deleting a single bond with the GAP_BondSetParam command. - Decreased CRC calculation time during OAD by using DMA. Bug Fixes: - Using a short connection interval and exercising high throughput, there was some loss of packets. This was fixed by adding host to application flow control support. - Bonding was unstable at short connection intervals. This is now fixed. - Fixed USB CDC Drivers to work with Windows 8. - OAD sample project would fail if long connection interval was used. This was fixed by not allowing parameter updates to the central device. - Fixed linking errors in UBL project. - Fixed minor issues in sample apps to work with PTS dongle. - Fixed USB descriptors in HostTestRelease to display correct string. Known Issues: - Use of the NV memory (to save application data or BLE Host bonding information) during a BLE connection may cause an unexpected disconnect. The likelihood of this happening increases with frequent usage, especially when using short connection intervals. The cause is related to the NV wear algorithm which at some point may cause an NV page erase which can disrupt system real-time processing. It is therefore recommended that the NV memory be used sparingly, or only when a connection is not active. - HCI packet size of 128 bytes or more will be disregarded by the stack, and as such, no HCI event will be returned. |
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vnwueurw 发表于 2020-3-24 06:31 楼上正解，BLE的安装文件夹内是有相关说明的 README.txt 也可以参考TI主页的说明 http://www.ti.com.cn/tool/cn/ble-stack BLE-Stack 1.4.0 的新软件功能包括：
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