深圳 某内资IT集团招聘MEMS Sensor 相关的测试, 可靠性资深工程师, 硕士以上10Y+经验, 薪资50w+ cv tomp0118@manpower.com.cn
Sr.Reliability Engineer（深圳-Band9） Position Description: • Develop reliability test plan for the Lenovo MEMS product based on goodunderstanding of properties critical for sensor performance, materialcharacteristics and limitations, mechanisms of their degradation; • Supervise reliability tests execution, analyze and report test results;facilitate accelerated development timelines; • Perform failure analysis of the sensor as a whole and its components,materials, coatings to support design and process team in improving sensorperformance; • Job requires ability to plan, and consistently deliver against plan ondevelopment and release to production milestones.
Job responsibilities include: • Work in team environment on developing test hardware and software; • Lead reliability characterization of MEMS sensor and its internal components. • Work on failure analysis projects to give feedback to internal process andpackaging development teams. • Deliver against the schedule and communicate status to various levels ofmanagement, peers and team members; • Work in a team environment to determine and improve product and materialrelated issues; • Contribute to the design and architecture of future products
Education: • MS or PhD in Material Science, Material Engineering, Chemistry, or Physics.
Qualifications: • In depth understanding of properties and chemistry of organic (polymers) andinorganic materials/coatings; excellent knowledge of respective analyticalmethods, defectoscopy. • Experience with semiconductor packaging, flip-chip technology, adhesives,metallic and semiconductor thin films. • Proven record of successful analytical work related either to introduction ofnew products in the mass production, or supporting volume manufacturing; • Good knowledge and understanding of JEDEC, ASTM reliability test standards • Excellent verbal and written language skills (English).
Experience: • 10+ Years minimum industry experience in conducting reliability tests andfailure analysis. • Demonstrated track record of bringing microelectronic components to volumemanufacturing. | 
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