PCB工程英文单词
2013年03月13日 09:45 来源：未知 作者：刘嘉文 我要评论(0)
单词
附件：attached
样品：sample
承认：approval
答复：answer;reply
规格：spec
与...同样的：the same as
前版本：previous version(old version)
生产：production
确认：confirm
再次确认：double confirm
工程问题：engineering query（EQ）
尽快：ASAP(as soon as possible)
生产文件：production gerber
联系某人：contact somebody
提交样板：submit sample
交货期：delivery date
电测成本：ET（electrical test） cost
通断测试：Open and short testing
参考：refer to
IPC标准：IPC standard
IPC二级：IPC class 2
可接受的：acceptable
允许：permit
制造：manufacture
修改：revision
公差：tolerance
忽略：ignore(omit)
工具孔：tooling hole
安装孔：mounting hole
元件孔：component hole
槽孔：slot
邮票孔：snap off hole
导通孔：via
盲孔： blind via
埋孔：buried via
金属化孔：PTH(plating through hole)
非金属化孔：NPTH( no plating through hole)
孔位：hole location
避免：avoid
原设计：original design
修改：modify
按原设计：leave it as it is
附边：waste tab
铜条：copper strip
拼板强度：panel strong
板厚：board thickness
删除：remove(delete)
削铜：shave the copper
露铜：copper exposure
光标点：fiducial mark
不同：be different from(differ from)
内弧：inside radius
焊环：annular ring
单板尺寸：single size
拼板尺寸：panel size
铣：routing
铣刀：router
V-cut：scoring
哑光：matt
光亮的：glossy
锡珠：solder ball(solder plugs)
阻焊：solder mask(solder resist)
阻焊开窗：solder mask opening
单面开窗：single side mask opening
补油：touch up solder mask
补线：track welds
毛刺：burrs
去毛刺：deburr
镀层厚度：plating thickness
清洁度：cleanliness
离子污染：ionic contamination
阻燃性：flammability retardant
黑化：black oxidation
棕化：brown oxidation
红化：red oxidation
可焊性：solderability
焊料：solder
包装：packaging
角标：corner mark
特性阻抗：characteristic impedance
正像：positive
负片：negative
镜像：mirror
线宽：conductor width
线距：conductor spacing
做样：build sample
按照：as per
成品：finished
做变更：make the change
相类似：similar to
规格：specification
下移：shift down
垂直地：vertically
水平的：horizontally
增大：increase
缩小：decrease
表面处理：Surface Finishing
波峰焊：wave solder
钻孔数据：drilling date
标记：Logo
Ul 标记：Ul Marking
蚀刻标记：etched marking
周期：date code
翘曲：bow and twist
外层：outer layer
内层：internal layer
顶层：top layer
底层：bottom layer
元件面：component side
焊接面：solder side
阻焊层：solder mask layer
丝印层：legend layer (silkscreen layer or over layer)
兰胶层：peelable SM layer
贴片层：paste mask layer
碳油层：carbon layer
外形层：outline layer(profile layer)
白油：white ink
绿油：green ink
喷锡：hot air leveling (HAL)
水金：flash gold
插头镀金：plated gold edge-board contacts
金手指：Gold-finger
防氧化：Entek(OSP)
沉金：Immersion gold (chem. Gold)
沉锡：Immersion Tin(chem.Tin)
沉银：Immersion Silver (chem. silver)
单面板：single sided board
双面板：double sided board
多层板：multilayer board
刚性板：rigid board
挠性板：flexible board
刚挠板：flex-rigid board
铣：CNC (mill , routing)
冲：punching
倒角：beveling
倒斜角：chamfer
倒圆角：fillet
尺寸：dimension
材料：material
介电常数：Dielectric constant
菲林：film
成像：Imaging
板镀：Panel Plating
图镀：Pattern Plating
后清洗：Final Cleaning
叠层：layup (stack-up)
污染焊盘：contaminate pad
分孔图：drill chart
度数：degree
被…覆盖：be covered with
负公差：minus tolerance
标靶盘： target pad
外形公差：routing tolerance
芯板：core
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