82573/82562 Dual Footprint Design Guide

　　TheIntel® 945/Intel® I/O Control Hub 7 （ICH7） 82801GB platform supports several

　　footprint compatibleEthernetoptions depending upon the target application. Theterm

　　“footprint compatible” means the silicon devices are all manufactured in a 15 mm by 15

　　mm， 196 Thin and Fine Ball Grid Array （TF-BGA） package， with the same ball pattern.

　　Many of the critical signalpin locations are identical， allowing designersto create a

　　single LAN on Motherboard （LOM） design thataccommodates all devices. This is a

　　flexible， cost-effective， multipurpose design technique thatmaximizes value while

　　meeting performance requirements.

　　Since some of the signal pins differ in usage， the term “pin compatible” is not

　　applicable.

　　Available LAN components with the same footprint include the Intel® 82573E， 82573V

　　and 82573L Gigabit Ethernet Controllers and Intel® 82562EZ， 82562EX， 82562GZ and

　　82562GX Platform LAN Connect （PLC） components. （For purposes of this document，

　　the 82573E， 82573V and the 82573L will be referred to as the 82573; and the

　　82562EZ， 82562EX， 82562GZ and 82562GX will be referred to as the 82562 unless

　　otherwise noted. Specific device datacanbe referenced in their respective datasheets

　　for feature differences.） ICHx refers to ICH6 and ICH7 components.

　　The requirements for connection speed and manageability determine which LAN

　　components should be used on a specific platform. As these requirements change，

　　footprint compatibility make it possible to refocus the platform without the need for a

　　motherboard redesi